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Die Bonders

We provide a variety of die bonders from Semiconductor Equipment Corp (S.E.C.) and their range include a simple manual pick and place bonder to high accuracy flip chip, laser diode and eutectic bonders

Visit the Epak Electronics Ltd website for more information on Die Bonders

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More Products

  • Wafer Backlap Applicator

  • Custom Abrasive Blast Systems

  • Thin Film Chip Resistors

  • Wafer Film / Frame Applicators