Therm-A-Gap thermal interface materials
THERM-A-GAPĀ® thermal interface materials fill air gaps between hot components and heat sinks or metal chassis. Their flexible, elastic nature allows them to blanket highly uneven surfaces. Heat is conducted away from separate components or entire PCBs into metal covers, frames or spreader plates.Visit the HITEK Electronics Materials Ltd. website for more information on Therm-A-Gap thermal interface materials