927 Water Recycling System Key Features Reduced Water Consumption by up to 95%Low Maintenance...
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937A Spindle Coolant Chiller Key Features Water circulation system reduces water consumptionE...
947 CO2 Re-Ionizer System Key Features Resistivity target settingAbility to integrate with up...
955 UV Tape Curing Systems Key Features Compact tabletop designProcess up to 50 frames per ho...
966 Key Features Versions for up to 200mm and 300mm wafersVersions for square substrates and ...
967 Semi-Automatic Wafer Mounter Key Features Automatic mounting process with hands free oper...
977 Key Features Efficient compact cleaningAtomizing and High pressure cleaning 200mm or 300...
Dage 4000 Plus Key Features Multi-function Bond Test: Pull, Ball Shear, Die Shear, Tweezer P...
DELO KATIOBOND Key Features Light-activated versions can be used in opaque applicationsVery f...
Aluminium Ribbon Key Features High-purity aluminium for high power applicationsCustom-manufac...
DELO-ML Key Features Fast-curing adhesives that cure at room temperatureExcellent for metal b...
DELO-PUR Key Features Two-part adhesives in DELO-AUTOMIX cartridgesExcellent strength with st...
Anisotropic Conductive Adhesive Key Features Conduct only in the vertical, or Z-axis, planeHi...
Founded over 20 years ago, ATP offers state-of-the-art thin film circuit processing. Operating out o...
ATP makes its own hard surface photomasks in a Class-100 chamber, produced on precision pattern-gene...
ATP offers an assortment of products for different applications. These include inductor coils that h...
To simplify the process as much as possible, ATP offers design guidelines on a range of topics. Info...
ATP's technological capabilities include Polyimide-supported bridges, solder dams, laser diode submo...
AS8/12 Key Features Compact Semiautomatic Wafer Spray Coater Precision Wafer Coating Equipmen...
Dage 4600 Key Features Fiducial alignment for parent and sub-surfacesCorrection for tool conc...
Amadyne fab1 Key Features Advanced packaging die bonder equipmentSuitable for die sorting and...
K&S RAPID Pro Key Features Fully Automatic Ball Bonder with Advanced CapabilitiesReal-time Pr...
PremierPLUS™ Key Features Automatic Wafer Bumping EquipmentHigh Speed Stud Bump Bonding on up...
ACS200 Gen3 Key Features Fully configurable Automatic Wafer Coat Develop ClusterTool for high...
Asterion Key Features Advanced automatic wedge bonder Ultrasonically bonds large wire, fine w...
Bathtub Packages and Flatpacks Key Features Compression sealed and matched sealed optionsComp...
PE-200 Key Features Available in Plasma Clean, Etch and RIE configurationsConvertible option:...
PE-50XL Key Features Continuously adjustable power rangeParallel plate electrode for optimum ...
PE-50 Key Features Compact designPLC control system with recipe storageTwo gas input linesOpt...
PE-100 Key Features Available in Plasma Clean, Etch and RIE configurationsConvertible option:...
DELO-ML Key Features One-part anaerobic-curing adhesivesCure in the presence of metal and the...