Fine Pitch Solder Pasting

Fine pitch solder pasting

One of the cornerstones of reliable board building is ensuring that when the solder paste is applied to the pads on the board that exactly the correct amount of paste is put down, and in the right place.

The Fuji fine pitch printer will accurately position the stencil and the board together with an optically calibrated and adjusted movement to ensure that they are accurately aligned within microns.

These machines will place parts on pads down to 300 micron pitch between pads.

The mechanism within the machines ensures that the correct volume of solder paste is also placed on the pads, and they contain hermetically sealed containers for the solder paste inside the machine to ensure that hygroscopy is avoided.

Once the first off board is pasted it is then X-Rayed to ensure that the paste is indeed placed in exactly the correct place on the board before the rest of the batch is completed.

Prima invested in two of these fine pitch pasters to ensure that there can be no cross contamination between leaded and lead free solder pastes