The following covers some of the applications:
Space envelope and shape can be determined within the layout
High voltage between connector pins can be achieved using a special moulding.
‘Make’ power before signal contact principle can be designed in
Environmental needs such as IP rating or ‘O’ ring sealing can be achieved
Connector backshell can be an integral part of the design
Visit the Tekdata Interconnections Ltd website for more information on Special Application Based Connectors