This range of DIP boards is provided with either single or double sided contacts for interfacing via direct, edge card connectors. Primarily low density, they have been designed for hard wiring of integrated circuits. A test point facility is given by copper pads situated at the front end of each board. Features: Ideal for hard wiring applications, Single or double sided contacts, Profiled or full width gold plated tongue, Choice of contact pitch and number of ways, Grid pattern to aid component placement.
Visit the Vero Technologies Ltd. website for more information on DIP Plug-In Boards