INDIUM CORPORATION EXPERTS TO PRESENT AT APEX 2017

Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will lead three sessions at the IPC APEX Expo technical conference on February 11-16 in San Diego, Calif. Dr. Lee will chair a two-part advanced professional development course on Choosing Solders for the New Era. Part 1 will be on Feb. 12 from 9 a.m.-noon, and part 2 will the same day from 2-5 p.m. Dr. Lee will also moderate a technical session on Solder Reliability onFeb. 14 from 1:30-3 p.m. Eric Bastow, Assistant Technical Manager, will moderate a session on Miniaturization on Feb. 16 from 9-10 a.m.; and Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will moderate a session on SIR Reliability on Feb. 14 from 3:30-5 p.m. Technical presentations by Indium Corporation experts will include: Does Thermal Cycling Impact the Electrical Reliability of No-Clean Solder Paste Flux Residue? by Eric Bastow, Assistant Technical Manager Process Optimization for Fine-Feature Solder Paste Dispensing by Maria Durham, Technical Support Engineer for Semiconductor and Advanced Assembly Materials Voiding Performance with Modified SAC Alloys for Automotive Applications and Understanding the Effect of Different Heating Cycles by Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials. For more information on the technical sessions offered at IPC APEX, visitwww.ipcapexexpo.org.