We use Zemax Engineering Edition throughout for all optic modeling needs, and will make use of Seque...
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There are 2 main types of encapsulation: Glob Top and Dam and Fill. Encapsulation is the process to ...
Temperature cycle,(-70degC to 180degC, 1degC/min ramp) High and Low temperature storage Qualific...
We have broad knowledge on the rheology, thermal, electrical and cure properties of a large variety ...
Once a product has been designed and prototype devices made customers will typically want to guarant...
We have vast experience in aligning and attaching fibers and optical components to large variety of ...
Flip chip bonding can provide a variety of advantages over other interconnection processes. Flip chi...
No delays for selection and commission of in-house equipment. Rapid prototyping (same day builds ...
Inspection tool for failure analysis or quality control 5kg sample weight; 50cm height limit Rea...
Our capabilities vary from the simple selection of a ball lens for coupling the output of an optical...
Our standard technology platform's allow customers to avoid important technical pitfalls and avoid c...
Understanding the desired environmental operating conditions, thermal, optical, mechanical and elect...
Prototyping on production toolset guarantees no hidden issues for production
The larger surface area of the ribbon makes it an perfect interconnection option for high speed RF a...
Optocap's standard technology platform's enables customers to seriously reduce important technical p...
We have experience with a large variety of solder materials including soft and hard solders, Pb-free...
Gold stud bumping forms Au bumps using a process like that of Au ball wire bonding. Like wire bondin...
We have the capabilities for Wafer saw of substrates up to 8” diameter. When dicing of substrates of...
Aluminum (Al) or Gold (Au) Wedge Bonding 20µm(0.8mil) - 51µm(2.0mil) diameter wire. Pitch down to 60...
We work closely with our customers at the package design stage to ensure that design for manufacturi...