Menu

Stud Bumping

Gold stud bumping forms Au bumps using a process like that of Au ball wire bonding. Like wire bonding it forms an Au ball (stud). However, the wire is terminated after the first bond so there is only a bump on the die.

Visit the Optocap Ltd. website for more information on Stud Bumping

ENQUIRY FORM

More Products

  • Wedge Bonding Services

  • Package Design & Modelling

  • Microfocus Xray

  • Solder Die Bonding