Semiconductor-grade materials for wafer level and flip chip processes.

• Halogen-free, water-soluble wafer bumping flux for the spin-coating process
• Halogen-free, water-soluble wafer bumping paste flux for the printing process
• Halogen-free, water-soluble ball attach paste flux for pin transfer and dipping
• Zero-halogen, no-clean flip chip paste flux for dipping, with extremely low residue